Epoxy Insulating Glass Fiber Copper Clad Laminate High-Reliability PCB FR‑4 CCL
Epoxy Glass Fiber Insulating Board High Dielectric Strength PCB Transformer Insulation, High Thermal Conductivity Heat Sink Insulator Plate for LED for PCB Substrate and Electronic Components
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Description
Epoxy Insulating Board Glass Fiber Copper Clad Laminate
Insulating Material：The insulating material (epoxy-resin-impregnated glass fabric) offers outstanding electrical performance: its surface and volume resistivity remain at ≥10⁶ MΩ even after humidity exposure, effectively suppressing leakage current and preventing breakdown.
Fiberglass Board (Substrate): The fiberglass board delivers exceptional mechanical performance: its longitudinal flexural strength reaches up to 565 N/mm², providing outstanding rigidity to firmly support large, heavy components.
